As one of the earliest and largest crystal grain cutting cutting material manufacturers in China, Xindaxin Materials successfully landed in the capital market with its strong competitive advantage in the industry. In the future, new and new materials will rely on technology and brand advantages to seize the opportunity of high-speed growth in the photovoltaic industry and the semiconductor industry, and to build new and new materials into the core competitiveness of crystalline silicon wafer cutting materials as the core product. The largest silicon carbide powder manufacturing base. Efforts will be made to develop new and new materials into excellent suppliers in the field of new energy and new materials based on research and development and production of silicon carbide powder products.
The logistical strength of the solar photovoltaic industry The main business of Xinda New Materials is the production and sales of crystalline silicon wafer cutting blades. It is the main supplier of special wafers for cutting wafers in the domestic photovoltaic industry. It is the earliest and largest crystal in China. One of the wafer cutting blade manufacturers.
The wafer wafer cutting blade manufacturing industry is a sub-sector in the photovoltaic industry chain and semiconductor industry chain. With the improvement of the economic environment, the performance of the photovoltaic industry in the second quarter of 2009 has also rebounded, and the solar industry has entered a gradual recovery cycle. It is estimated that the global solar cell production will maintain a growth of around 30% from 2009 to 2011, and the newly installed capacity will reach 8.2GW, 10.6GW and 15.4GW in the next three years.
At this stage, the cost of crystalline silicon wafers for manufacturing solar cells accounts for about 70% of the cost of solar cell production. Therefore, the utilization rate of crystalline silicon raw materials and processing costs largely determine the cost of the entire photovoltaic power generation system and reduce the crystalline silicon. The thickness of the sheet and the fragmentation rate are the key to reducing the cost of the wafer. Therefore, the quality of the wafer wafer cutting material is particularly important. Due to the excellent quality and stability of the cutting wafers produced by the company, the cutting effect is good. At present, the well-known domestic manufacturers of crystalline silicon wafers are customers of the company. These customers have plans to significantly expand the productivity of crystalline silicon wafers.
Another important application area for wafer wafer cutting materials is the manufacture of semiconductor wafers, so the development of the industry also depends on the development of the downstream semiconductor industry. According to forecasts, the global semiconductor output value will maintain a steady growth trend from 2009 to 2011, which will drive the demand for cutting wafers for semiconductor wafers, and the market prospect is good.
Strengthening the leading position in the market Driven by the rapid growth of the global PV industry and the sharp increase in the price of cutting blades, the company's revenue scale and profitability have increased rapidly in recent years. From 2007 to 2009, the company's main business income growth rate was 66.75%, and the net profit compound growth rate was 110.56%.
This time, the newly raised funds will be invested in the annual production of 25,000 tons of solar wafer cutting special blade material expansion project, crystalline silicon wafer cutting waste mortar recycling and reuse project, with an annual output of 8,000 tons of semiconductor wafers. The silicon carbide special cuttings project for sheet cutting, R&D center projects and other working capital projects related to the main business. The total investment is 500 million yuan, and a total of 389 million yuan of funds will be invested.
The solar crystal wafer manufacturing industry has entered a stage of rapid development, and the demand for solar wafer cutting blades has been increasing rapidly. Among them, the domestic demand in 2006-2008 was 12,500,000 tons, 35,100 tons and 76,000 tons respectively; the global demand increased from 85,000 tons in 2007 to 1.62 million tons in 2008, an increase of 90.59%.
At present, the company's crystalline silicon wafer cutting edge material project has an annual production capacity of 15,000 tons, and the supply gap is large, which is insufficient for some customers. After the fundraising project is put into production, the company can increase the production capacity of 25,000 tons of crystalline silicon wafer cutting blade material every year, which can effectively solve the problem of insufficient production capacity and consolidate the company's industry status. After the project is completed and put into production, it is estimated that the annual sales income will increase by about 627 million yuan, and the annual average net profit will increase by about 81 million yuan.
At present, there is no domestic production capacity for semiconductor wafers, and the company has already produced products with the same quality and performance in Japan, and the price is lower than that of Japanese products. The company will build 8,000 tons of semiconductor wafers. After the project is completed and put into production, the annual sales income will increase by about 260 million yuan, and the annual average net profit will increase by about 49 million yuan. In addition, in order to maintain the company's technological advantages and provide quality products, the company raised investment in the construction of research and development centers.
With the completion of the fundraising project, the annual new revenue and net profit were 1.107 billion yuan and 166 million yuan, equivalent to 1.94 and 1.70 times of the company in 2009, and the effect of thickening the performance was significant.
Four major competitive advantages highlight the value As the largest manufacturer of crystalline silicon wafer cutting edge materials in China, the core competitive advantages in this industry are mainly reflected in four aspects.
First, production technology and product quality advantages. Xindaxin Materials has core technical advantages in product development and production process of crystalline silicon wafer cutting blades. The production technology and product quality have reached the level of international similar products. The company's core team members have more than 20 years of experience in the production of silicon carbide powder and related industries in production management, technology research and development, and equipment maintenance.
The second is the customer resource advantage. As an important supplier of the main solar crystal wafer production enterprises in China, Xindaxin Materials has achieved and maintained high-quality customer resources with stable product quality and perfect after-sales service, and has a high reputation in the industry. The company's major customers include leading companies in the photovoltaic industry such as Jiangxi LDK, Yingli New Energy, Shunhui Sunshine, and Jinglong Group, covering major domestic wafer wafer manufacturers.
The third is the advantage of raw material procurement. The main raw material for the production of crystalline silicon wafer cutting blades is silicon carbide. In order to ensure sufficient supply of raw materials, the company has established long-term and stable cooperative relations with major domestic silicon carbide production enterprises, and participated in the main supplier, Kuitun Longhai Technology Development Co., Ltd., to further maintain and expand the company's raw material procurement advantages. .
The fourth is the economic advantage of scale. There are few enterprises in China that can produce wafer silicon cutting blades on a large scale, which is far from meeting the cutting production requirements of solar cell wafers and semiconductor wafers. The company's wafer wafer cutting blade sales volume exceeds 23,000 tons, with a continuous and stable supply capacity, and significant economies of scale.
In addition, Xinda New Materials also has the advantages of industrial location, etc. The company is located in Kaifeng City, Henan Province. Henan Province is one of the largest silicon carbide granulation and milling production bases in China with convenient transportation and low production costs. At the same time, Zhengzhou University, Henan University and other well-known universities provide sufficient technical and talent support for the company's subsequent technological transformation and new product development.
“Excellent supplier in the field of new materialsâ€
At present, the company is aiming at “developing and producing silicon carbide powder products, making excellent suppliers in new energy and new materialsâ€, relying on the company's technology and brand advantages to seize the opportunity of high-speed growth of photovoltaic industry and semiconductor industry. The company will be the most competitive core and largest silicon carbide powder manufacturing base with crystalline silicon wafer cutting edge as its core product. In the next three years, the company will expand the company's production scale, enhance research and development capabilities, improve the overall efficiency of the company and achieve the following goals through various financing channels including stock financing:
Make bigger and stronger solar crystal wafer cutting edge products. The company will make full use of existing technology, expand production scale, implement waste mortar recycling and reuse projects, reduce production costs, improve production efficiency, and contribute to the popularization of solar energy applications.
The company will increase the supply of silicon carbide special cutting edge products for semiconductor wafer cutting, enrich the company's product structure, and realize its leading position in the domestic silicon wafer special blade material for semiconductor wafer cutting, and open up the international market.
Develop new products around other powder materials. The company has accumulated valuable experience and technology in the preparation of high-purity, ultra-fine powder materials. In addition to solar wafer cutting materials, the company will carry out other powder product development.
Landing on the GEM and docking with the capital market is another milestone in the history of the development of new and new materials. Through the realization of the above-mentioned business objectives, Xindaxin Materials will gradually form a comprehensive production enterprise with crystal silicon wafer cutting edge products as the core, including other products such as silicon carbide and other micro-powder products.
The logistical strength of the solar photovoltaic industry The main business of Xinda New Materials is the production and sales of crystalline silicon wafer cutting blades. It is the main supplier of special wafers for cutting wafers in the domestic photovoltaic industry. It is the earliest and largest crystal in China. One of the wafer cutting blade manufacturers.
The wafer wafer cutting blade manufacturing industry is a sub-sector in the photovoltaic industry chain and semiconductor industry chain. With the improvement of the economic environment, the performance of the photovoltaic industry in the second quarter of 2009 has also rebounded, and the solar industry has entered a gradual recovery cycle. It is estimated that the global solar cell production will maintain a growth of around 30% from 2009 to 2011, and the newly installed capacity will reach 8.2GW, 10.6GW and 15.4GW in the next three years.
At this stage, the cost of crystalline silicon wafers for manufacturing solar cells accounts for about 70% of the cost of solar cell production. Therefore, the utilization rate of crystalline silicon raw materials and processing costs largely determine the cost of the entire photovoltaic power generation system and reduce the crystalline silicon. The thickness of the sheet and the fragmentation rate are the key to reducing the cost of the wafer. Therefore, the quality of the wafer wafer cutting material is particularly important. Due to the excellent quality and stability of the cutting wafers produced by the company, the cutting effect is good. At present, the well-known domestic manufacturers of crystalline silicon wafers are customers of the company. These customers have plans to significantly expand the productivity of crystalline silicon wafers.
Another important application area for wafer wafer cutting materials is the manufacture of semiconductor wafers, so the development of the industry also depends on the development of the downstream semiconductor industry. According to forecasts, the global semiconductor output value will maintain a steady growth trend from 2009 to 2011, which will drive the demand for cutting wafers for semiconductor wafers, and the market prospect is good.
Strengthening the leading position in the market Driven by the rapid growth of the global PV industry and the sharp increase in the price of cutting blades, the company's revenue scale and profitability have increased rapidly in recent years. From 2007 to 2009, the company's main business income growth rate was 66.75%, and the net profit compound growth rate was 110.56%.
This time, the newly raised funds will be invested in the annual production of 25,000 tons of solar wafer cutting special blade material expansion project, crystalline silicon wafer cutting waste mortar recycling and reuse project, with an annual output of 8,000 tons of semiconductor wafers. The silicon carbide special cuttings project for sheet cutting, R&D center projects and other working capital projects related to the main business. The total investment is 500 million yuan, and a total of 389 million yuan of funds will be invested.
The solar crystal wafer manufacturing industry has entered a stage of rapid development, and the demand for solar wafer cutting blades has been increasing rapidly. Among them, the domestic demand in 2006-2008 was 12,500,000 tons, 35,100 tons and 76,000 tons respectively; the global demand increased from 85,000 tons in 2007 to 1.62 million tons in 2008, an increase of 90.59%.
At present, the company's crystalline silicon wafer cutting edge material project has an annual production capacity of 15,000 tons, and the supply gap is large, which is insufficient for some customers. After the fundraising project is put into production, the company can increase the production capacity of 25,000 tons of crystalline silicon wafer cutting blade material every year, which can effectively solve the problem of insufficient production capacity and consolidate the company's industry status. After the project is completed and put into production, it is estimated that the annual sales income will increase by about 627 million yuan, and the annual average net profit will increase by about 81 million yuan.
At present, there is no domestic production capacity for semiconductor wafers, and the company has already produced products with the same quality and performance in Japan, and the price is lower than that of Japanese products. The company will build 8,000 tons of semiconductor wafers. After the project is completed and put into production, the annual sales income will increase by about 260 million yuan, and the annual average net profit will increase by about 49 million yuan. In addition, in order to maintain the company's technological advantages and provide quality products, the company raised investment in the construction of research and development centers.
With the completion of the fundraising project, the annual new revenue and net profit were 1.107 billion yuan and 166 million yuan, equivalent to 1.94 and 1.70 times of the company in 2009, and the effect of thickening the performance was significant.
Four major competitive advantages highlight the value As the largest manufacturer of crystalline silicon wafer cutting edge materials in China, the core competitive advantages in this industry are mainly reflected in four aspects.
First, production technology and product quality advantages. Xindaxin Materials has core technical advantages in product development and production process of crystalline silicon wafer cutting blades. The production technology and product quality have reached the level of international similar products. The company's core team members have more than 20 years of experience in the production of silicon carbide powder and related industries in production management, technology research and development, and equipment maintenance.
The second is the customer resource advantage. As an important supplier of the main solar crystal wafer production enterprises in China, Xindaxin Materials has achieved and maintained high-quality customer resources with stable product quality and perfect after-sales service, and has a high reputation in the industry. The company's major customers include leading companies in the photovoltaic industry such as Jiangxi LDK, Yingli New Energy, Shunhui Sunshine, and Jinglong Group, covering major domestic wafer wafer manufacturers.
The third is the advantage of raw material procurement. The main raw material for the production of crystalline silicon wafer cutting blades is silicon carbide. In order to ensure sufficient supply of raw materials, the company has established long-term and stable cooperative relations with major domestic silicon carbide production enterprises, and participated in the main supplier, Kuitun Longhai Technology Development Co., Ltd., to further maintain and expand the company's raw material procurement advantages. .
The fourth is the economic advantage of scale. There are few enterprises in China that can produce wafer silicon cutting blades on a large scale, which is far from meeting the cutting production requirements of solar cell wafers and semiconductor wafers. The company's wafer wafer cutting blade sales volume exceeds 23,000 tons, with a continuous and stable supply capacity, and significant economies of scale.
In addition, Xinda New Materials also has the advantages of industrial location, etc. The company is located in Kaifeng City, Henan Province. Henan Province is one of the largest silicon carbide granulation and milling production bases in China with convenient transportation and low production costs. At the same time, Zhengzhou University, Henan University and other well-known universities provide sufficient technical and talent support for the company's subsequent technological transformation and new product development.
“Excellent supplier in the field of new materialsâ€
At present, the company is aiming at “developing and producing silicon carbide powder products, making excellent suppliers in new energy and new materialsâ€, relying on the company's technology and brand advantages to seize the opportunity of high-speed growth of photovoltaic industry and semiconductor industry. The company will be the most competitive core and largest silicon carbide powder manufacturing base with crystalline silicon wafer cutting edge as its core product. In the next three years, the company will expand the company's production scale, enhance research and development capabilities, improve the overall efficiency of the company and achieve the following goals through various financing channels including stock financing:
Make bigger and stronger solar crystal wafer cutting edge products. The company will make full use of existing technology, expand production scale, implement waste mortar recycling and reuse projects, reduce production costs, improve production efficiency, and contribute to the popularization of solar energy applications.
The company will increase the supply of silicon carbide special cutting edge products for semiconductor wafer cutting, enrich the company's product structure, and realize its leading position in the domestic silicon wafer special blade material for semiconductor wafer cutting, and open up the international market.
Develop new products around other powder materials. The company has accumulated valuable experience and technology in the preparation of high-purity, ultra-fine powder materials. In addition to solar wafer cutting materials, the company will carry out other powder product development.
Landing on the GEM and docking with the capital market is another milestone in the history of the development of new and new materials. Through the realization of the above-mentioned business objectives, Xindaxin Materials will gradually form a comprehensive production enterprise with crystal silicon wafer cutting edge products as the core, including other products such as silicon carbide and other micro-powder products.
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