Superfine cutting tool performance and processing applications

To meet these demands in the market, we have developed the world's smallest class of ultra-precision diamond cutting tools (UPC micro-nano forming tools). This article will introduce the performance of our UPC (Super Finish Cutting Tool) and its application in 3D shape micromachining.

Performance of UPC superfine diamond cutting tool
Ultra-precision diamond cutting tools use single crystal diamond as the tool material. Thanks to the excellent properties of the diamond material, the cutting edge is very sharp and durable, and the motion of the superfinishing machine can be accurately reproduced on the workpiece material, so it can be used for high-precision 3D shape and mirror surface processing.

Ultra-fine cutting from sub-micron to nano-scale requires the following cutting conditions: 1 sharp cutting edge, the radius of the cutting edge reaches about 10 nanometers; 2 the cutting edge finish requires a level of 1 nanometer. The smaller the radius of the tool nose arc, the smaller the depth of cut, and the cutting and removal process of the chip can be smoothly performed without damaging the machined surface. In addition, the change in the thickness of the cutting due to the elastic deformation of the workpiece is smaller, thereby achieving High precision machining. The cutting edge of the UPC tool can reach 50 nm or less.

If the finished surface of the tool profile is completely reproduced on the workpiece, the roughness of the tool cutting edge will determine the roughness of the machined surface. Therefore, the smoothness and shape accuracy of the cutting edge become extremely important. As far as UPC-R is concerned, we have reached the world's highest precision equal to or less than 50 nanometers. To achieve such cutting performance, we have developed our own proprietary high precision measuring system. In addition, the use of diamond polishing systems, the use of scientific methods to select diamond and its lattice direction is also necessary and indispensable. By applying these proprietary technologies, we have developed the world's smallest ultra-precision diamond cutting tool for three-dimensional microforming, the UPC micro-nano forming tool.

UPC micro-nano forming tool
Up to now, three-dimensional micro-forming processes generally refer to micromachining and semiconductor manufacturing techniques (such as photolithography, ion beam processing, etc.). These processing methods have their inadequacies, such as the difficulty of obtaining smooth surfaces, which are determined by their forming characteristics, because the inclined planes and curved surfaces are formed by stepwise approximation. In contrast, the cutting and forming process of the three-dimensional micro-forming process based on the super-precision diamond cutting tool is performed by a sharp cutting edge, so that a smooth inclined plane or curved surface can be obtained. In addition, our tools have improved properties such as very high shape accuracy. Another advantage is the increased range of materials available.

Due to the above characteristics, the demand for such tools has been increasing in recent years. It is not only used for the processing of photovoltaic basic components, but also in the fields of microelectromechanical systems (MEMS), micromachines and biomedicine. We have successfully developed three types of micro-nano forming tools, and an example of forming them will be described below.

UPC nano rectangular end mill
Nano-rectangular end mills are used for the forming of ultra-fine free-form surface grooves. We have developed the world's smallest single crystal diamond end mill with a radius of revolution of only φ30μm. As described above, the tip of the nano-end mill is made by super-finishing the single crystal diamond, and the cutting edge is very sharp, straight and wear-resistant. This tool is expected to be applied to grooved machining including three-dimensional curves such as optical components, medical chips, and micromechanical parts.

UPC nano-rectangular end mill forming processing example
The machining example of forming a super-fine groove by using a nano-end mill and a cutter having a radius of 200 μm to perform a three-dimensional milling process on the mold clearly shows that the movement of the forming tool is accurately reproduced by the tool onto the workpiece to be processed without any burrs. The surface roughness (P-V value) of the groove bottom reached 101 nm.

UPC nano ball end mill
In the industry related to IT (Information Technology), the basic components for high-speed and large-capacity information are developing rapidly. One such technique is the microlens array. The array structure is a combination of a series of convex and concave lenses integrated in a three-dimensional scale. In recent years, the lens array has been applied to optical communication and liquid crystal projection screens. Our UPC nano ball end mills can be used to machine three-dimensional lens surfaces and free-curvature surfaces (such as molds for manufacturing microlens arrays).

We have developed the world's smallest blade radius (R = 30μm) and can produce the world's highest level of cutting edge profile (50nm tip). With such a tool, it is possible to realize a three-dimensional shape forming process with nanometer precision.

UPC nano ball end mill processing example
An example of forming a three-dimensional profile by milling a nano ball end mill can confirm that a nano ball end mill with a radius of R=300 μm can form a spherical surface with high sphericity and a high-precision surface without burrs. . The surface topography measuring instrument was used to measure the shape accuracy of a microsphere nest on the array mold, and its PV value (peak-to-peak) was 166 nm.

UPC nano grooving knife (super fine groove cutting tool)

The two nano-end milling cutters described above are used for milling, while the nano-grooving knives use a shaving and flying-cutting method to machine ultra-fine linear grooves on the workpiece forming surface. We have machined the world's smallest level of 5μm slot width. The most representative application of this tool is the forming of a holographic optical element (HOE) mold. The optical element is a polarization beam splitter which produces a diffraction phenomenon of light by means of a lens having a plurality of ultra-fine grooves having a groove pitch of up to a micron order, thereby achieving arbitrary decomposition and convergence of the spectrum. The optical effects of several optical lenses are combined into one holographic optical element (HOE). In the past, these optical components were fabricated by semiconductor processing techniques (such as photolithography), but when processed by this method, the bottom edge of the right-angled groove should be rounded; when the deep groove is processed, the forming process of the groove is Decomposed into multiple step formations, thus creating horizontal differences that reduce light utilization.

Unlike the processing method, a plastic holographic optical element (HOE) manufactured by a mold formed by a nano-grooving knife has better shape accuracy and surface roughness. In addition, the method also has
Have the advantage of high processing efficiency. With the development of photovoltaic technology in recent years, the demand for smaller ultra-fine groove forming processing is still increasing.

in conclusion
This paper introduces the characteristics of UPC micro-nano forming tools and three-dimensional micro-forming processing examples based on machining. In the three-dimensional micro-forming process using a diamond cutting tool, the shape of the tool tip is reproduced to the workpiece to be processed with high precision. Undoubtedly, in the application of surface forming processing technology, the future market will put forward higher requirements for nano-scale processing precision.

The performance and control technology of ultra-precision forming machines and the accuracy under machining conditions are constantly being improved and improved. Therefore, we are working to further improve the precision and miniaturization of diamond cutting tools.

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